4-Biphenylylmethyl acrylate

Main applications:
Electronic packaging and adhesive materials.
As a light-curing or heat-curing acrylate monomer, it is used in the manufacture of adhesives or encapsulants for electronic components.
It is particularly suitable for electronic components requiring high insulation properties, such as semiconductor chips, printed circuit boards (PCBs), and LED devices.

Main applications:
Highly transparent optical adhesives.
Due to its bisphenol structure and aromatic rings, the cured adhesive exhibits high transparency and excellent optical properties, making it suitable for bonding display devices or optical components.