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3,4-Epoxycyclohexylmethyl methacrylate

January 23, 2026

I. Product information

Product name:3,4-Epoxycyclohexylmethyl methacrylate

CAS:82428-30-6

Appearance:colorless or light yellow liquid

Purity:95% min

MF:C11H16O3

MW:196.24

Transport Information: Non-dangerous goods

HS Code:2918990090

Packaging:1kg/5kg/25kg or According to customers’ requirements

Storage:Store in a tightly sealed container in a cool, dry, and well-ventilated place.

              Away from direct sunlight and high temperatures.

Product manager email:eva@coreychem.com

II. Product properties

1.High Reactivity: The methacrylate double bond can rapidly polymerize via free radical mechanisms (e.g., UV light, thermal initiators); the epoxy group can polymerize via cationic mechanisms (e.g., UV light, acid) or ring-opening with amines/anhydrides.
2.Excellent Adhesion: The epoxy group provides strong adhesion to various substrates such as metals, glass, and plastics.
3.High Hardness and Resistance: Forms a dense cross-linked network upon curing, resulting in high hardness, excellent chemical resistance (to solvents, acids, bases), and good heat resistance.
4.Low Shrinkage: Its cyclic structure helps reduce volume shrinkage during polymerization compared to pure acrylates, minimizing internal stress and improving dimensional stability.
5.Good Dilution and Compatibility: Can act as a reactive diluent and is miscible with other UV-curable resins like epoxy acrylates and urethane acrylates.

III. Application

           1.UV-Curable Coatings and Inks:

    • High-end Metal Coatings:​ Used in primers and topcoats for metals (e.g., automotive parts, cans, aluminum), providing superior adhesion and corrosion resistance.
    • Plastic Coatings:​ Applied on plastic substrates like mobile phone casings and appliance panels to enhance surface hardness, scratch resistance, and aesthetics.
    • Abrasion-Resistant Floor Coatings:​ Offers high hardness and chemical resistance.
    • High-Performance Printing Inks:​ Especially in areas requiring chemical resistance and adhesion.
           2.Electronic Materials:
    • Photoresists:​ A key monomer used in photoresists for manufacturing LCD displays, such as color filters and spacers, leveraging its high reactivity and thermal stability.
    • Electronic Encapsulants and Adhesives:​ Used in packaging materials requiring fast curing, low shrinkage, and high reliability.
    • Optical Fiber Coatings:​ Protects optical fibers, providing good mechanical properties and environmental resistance.

           3.Adhesive:

    • Structural and Composite Adhesives:​ Used for bonding metals and glass, combining the strong adhesion of epoxies with the fast curing of acrylates.
    • Anaerobic Adhesives:​ Can be used in modified formulations.

            4.Composite Materials:

    • Used as a resin matrix or modifier in high-performance glass or carbon fiber composites to improve mechanical properties and heat resistance.
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