1-Butoxyethyl methacrylate, with excellent comprehensive performance, adapts to multi-scenario requirements and provides core raw material support for the industrial and high-end electronic materials fields.
As a key monomer with both polymerization activity and stability, 1-butoxyethyl methacrylate (CAS NO.: 85997-75-7) is a colorless to pale yellow transparent liquid, with a molecular formula of C₁₀H₁₈O₃, a molecular weight of 186.25, and a minimum purity of 98%. It is classified into the category of electronic materials.
Its unique molecular structure endows it with excellent film-forming property, weather resistance and chemical corrosion resistance, as well as good compatibility. It can accurately meet the needs of different industries according to purity grades, and is divided into two series: industrial grade and electronic grade.
Industrial Grade Products: Lay a Solid Performance Foundation for General Manufacturing
Industrial grade products are preferred raw materials in the coating and adhesive industries. As a comonomer in special coatings, it can improve the weather resistance, corrosion resistance and adhesion of coatings, and is widely used in industrial protection, automotive refinishing, wood decoration and UV-curable coating systems.
In the field of adhesives, it can optimize the bonding strength, flexibility and high/low temperature resistance of products, suitable for scenarios such as building curtain wall bonding, electronic component fixing and automotive sealing. Meanwhile, as a polymer modifying monomer, it can improve the processing and mechanical properties of materials, and can also be adapted to UV-curable inks to enhance curing efficiency and wear resistance, meeting the needs of various printing applications.
Electronic Grade Products: Address Core Needs of High-End Electronic Materials
High-purity electronic grade products meet the high-end demand of the electronic industry and are key raw materials for high-end electronic materials. In semiconductor and display photoresists, it can adjust resin performance, optimize line precision, and contribute to the fabrication of fine circuits for semiconductor chips and pixel lithography of LCD/OLED panels.
In the PCB/FPC field, it can improve the performance of solder mask inks and ensure the stability of circuit boards; when used in electronic encapsulants, it balances flexibility and damp-heat resistance, meeting the encapsulation needs of chips and sensors; at the same time, it can optimize the performance of optoelectronic materials, satisfying the optical and protective requirements of display devices.
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